World-class Professional Outsourcing Manufacturing
Our factories are designed to handle High-Mix, Low-Volume[HMLV] programs as well as High-Volume Manufacturing[HVM]. All facilities are equipped with state-of-the-art surface-mount technology (SMT), plated through-hole (PTH)/ dual in-line package (DIP), soldering assembly machines, solder paste inspection(SPI) machines, automatic optical inspection(AOI) machines, 3D X-Ray inspection system, precision PCBA routing machine, automatic conformal coating machine, green laser engraving machine and selective wave soldering machine, etc.
Gigatek Inc. devoted to capital investment to provide better productivity and excellent services.
To fulfill this, we installed the advanced 5-axis controlled X-Ray inspection system to maintain 3D X-Ray CT inspection capability.
Major equipment
    Name
    Brand
    Model
    Function
    Q'ty
    Capacity/Character
  • Auto Printer
  • DEK
    • HORIZON 8 AP
    • HORIZON 03iX
    • Solder Paste Printer
    • Solder Paste Printer
    • 3
    • 2
    • Cpk > 2.0 @ ± 12.5㎛, (± 6 δ)
    • Cpk > 2.0 @ ± 12.5㎛, (± 6 δ)
  • Glue Dispenser
  • JUKI
  • KD-2077
  • SMT
  • 1
  • 36000 points/hr.

  • Solder Paste Inspection Machine
  • OMRON
  • VP-5200L-V
    • Average height of printed solder paste, bumps, less tin, positional offset, bridging
  • 3
        (mm
      • 2
      • /sec)
        20μm:4500,10μm:2800
  • Chip Mounter
    • JUKI
    • JUKI
    • KE-2070L
    • KE-3010L
    • The placement speed is 0.155 sec (accuracy ±0.04mm)
    • The placement speed is 0.153 sec (accuracy ±0.04mm)
    • 3
    • 2
    • 12 sec./pc.
    • 12 sec./pc.
  • Multi-Function Mounter
    • JUKI
    • JUKI
    • KE-2080L
    • KE-3020L
    • The placement speed is 0.172 sec (accuracy ±0.03mm)
    • The placement speed is 0.178 sec (accuracy ±0.03mm)
    • 1
    • 3
    • 20,900 point/hr. (CHIP)
    • 20,200 point/hr. (CHIP)
  • Convection Reflow Ovens
    • HELLER
    • Vitronics
    • Loyal Sun
    • 1826MK-5 N2
    • MR933
    • LS-16RN
    • N2 Reflow
    • N2 Reflow
    • N2 Reflow
    • 2
    • 2
    • 1
    • 15's/Pcs
  • Automatic Optical Inspection
  • Tri
    • TR7501DT
    • TR7700L SIII DT
    • PCB
    • PCB
    • 4
    • 1
    • Resolution :15μm

  • BGA Rework Station
  • ERSA
  • HR-600
    • Repair BGA package parts
  • 1
    • Hybrid emitter with medium wave length IR heaters combined with convection convection
  • Selective Soldering Systems
  • ERSA
  • ECOSELECT 1
  • Stylized solder Dip components
  • 1
  • 2 - 100 mm/s
  • Laser Engraving
  • SUNSDA
  • SLK-300
  • Create ID for component/PCB
  • 1
  • 300mm*300mm
  • X-Ray 3D CT
  • GE
  • Micromex
  • 2D,2.5D, CNC, CT
  • 1
  • Resolution :0.9μm
  • Flying probe tester
  • TESTING HOUSE KOREA
  • TK2
    • Measurement Speed
    • Min Contact Pad
    • Min Contact Pitch
    • Single Probe Repeatability
  • 1
    • 5 locations/sec
    • 100 micron(0.1mm)
    • 500 micron(0.5mm)
    • ±50 micron(0.05mm)
  • X-Ray Fluorescence Analyzer
  • HITACHI
  • EA1000AⅢ
  • Rapid screening of RoHS controlled substances (desktop)
  • 1
  • Elemental analysis can range from aluminum (Al13) to uranium (U92)